Glass passivated chip junction available in unidirectional and bidirectional variants. It boasts 600 W peak pulse power capability with a 10/1000 Ī¼s waveform, featuring a repetitive rate (duty cycle) of 0.01%. This device offers excellent clamping capability, very fast response time, and low incremental surge resistance. It is solder-dip capable up to 275 Ā°C for a maximum of 10 seconds per JESD 22-B106 standard and is AEC-Q101 qualified.
Description
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PTS645SH50SMTR9
Electrical
CONTACT RATING: 50 mA @ 12 V DC.
DIELECTRIC STRENGTH: 250 V AC min.
CONTACT RESISTANCE: 100 mā¦ max. initial.
INSULATION RESISTANCE: 10 ā¦ min.
Environmental
OPERATING TEMPERATURE: -20 ĢC to 60 ĢC
Mechanical
ACTUATION FORCE: PTS645 models: 130 grams, 160 grams,
200 grams, 260 grams
LIFE EXPECTANCY: 100,000 operations.
Specification
FUNCTION: Momentary action
CONTACT ARRANGEMENT: SPST, N.O.
TERMINALS: PC pins
Process
SOLDERING: Preheating to 100 ĢC for 45 sec. max. Keep flux flush
with top surface of PCB; do not apply to component side of PCB
and area where terminals are located. Soldering to 255 ĢC for 5 sec.
max. Clean by brushing on solder surface. Do not clean switch with
solvents.
Packaging
Bulk packaging.
Tape & reel for the SMT type:
Reel of 1,000 pieces
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