features:
1. **600W Peak Pulse Capability at 10/1000μs**: This diode can handle transient spikes up to 600W of power with a waveform characterized by a 10/1000μs pulse width, at a very low repetition rate (duty cycle) of 0.01%. This capability makes it suitable for protecting sensitive electronic circuits from sudden voltage surges.
2. **Glass Passivated Chip Junction in DO-15 Package**: The diode is packaged in a DO-15 package, which typically allows for good heat dissipation and mechanical robustness. The glass passivation helps to protect the junction and improve long-term reliability.
3. **Fast Response Time**: The diode exhibits a very fast response time of typically less than 1.0ps from 0 Volts to its minimum breakdown voltage (BV min). This rapid response ensures that it clamps the transient voltage spike quickly, preventing damage to downstream components.
4. **Excellent Clamping Capability**: It has excellent clamping capability, which means it can limit the peak voltage during a transient event to a safe level, protecting the circuitry.
5. **Typical Failure Mode**: When exposed to voltages or currents beyond its rated specifications, the diode typically fails in a short circuit mode. This failure mode is advantageous as it does not allow damaging voltages to propagate further.
6. **Whisker Test (JEDEC JESD201A)**: This test ensures that the diode meets specific industry standards for whisker formation, which can affect long-term reliability and performance.
7. **ESD (Electrostatic Discharge) and EFT (Electrical Fast Transients) Protection**: It complies with IEC 61000-4-2 for ESD protection up to 30kV (Air and Contact discharge) and IEC 61000-4-4 for EFT protection. These standards ensure that the diode can withstand and protect against common electromagnetic disturbances.
8. **Low Incremental Surge Resistance**: The diode offers low incremental surge resistance, minimizing the impact on circuit performance during surge events.
9. **Low Leakage Current (IR)**: The leakage current (IR) is typically less than 1μA when the minimum breakdown voltage (VBR min) exceeds 12V. This low leakage current is essential for maintaining efficiency and reliability in the circuit.
10. **Compatible with High Temperature Reflow Soldering**: It can withstand high-temperature reflow soldering processes (up to 260°C for 30 seconds), which is standard in modern electronics manufacturing.
11. **Temperature Characteristics**: The breakdown voltage (VBR) varies with temperature (TJ), following a temperature coefficient (αT) of approximately 0.1%. This characteristic ensures consistent performance across a range of operating temperatures.
12. **UL Recognized Epoxy**: The epoxy used is UL Recognized with a V-0 flammability classification, indicating high flame resistance.
13. **Matte Tin Lead-Free Plating**: The diode features matte tin lead-free plating, complying with RoHS (Restriction of Hazardous Substances) regulations and environmental standards.
14. **Halogen-Free and RoHS Compliant**: It is manufactured using materials that are halogen-free and compliant with RoHS directives, ensuring minimal environmental impact.
15. **Pb-Free E3**: This designation confirms that the diode’s second-level interconnects are lead-free, and the terminal finish material is tin (Sn), meeting IPC/JEDEC J-STD-609A.01 standards.
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