FEATURES:
– **Peak Pulse Capability:** Can handle pulses up to 1500W at a 10/1000Ī¼s waveform with a low duty cycle of 0.01%.
– **Package:** DO-201 package with a glass passivated chip junction.
– **Response Time:** Very fast, typically less than 1.0ps from 0 Volts to minimum breakdown voltage (BV min).
– **Clamping Capability:** Excellent protection against voltage spikes.
– **Failure Mode:** Typically shorts when subjected to over-specified voltage or current.
– **Testing Standards:** Whisker test conducted according to JEDEC JESD201A standards (table 4a and 4c).
– **ESD and EFT Protection:** Conforms to IEC standards 61000-4-2 (30kV air/contact) and 61000-4-4 for data lines.
– **Electrical Properties:** Low incremental surge resistance, with typical leakage current (IR) less than 1Ī¼A when BV min is greater than 12V.
– **Temperature Handling:** Can withstand high temperatures up to 260Ā°C during reflow soldering.
– **Temperature Coefficient:** Breakdown voltage (VBR) varies with temperature based on a typical temperature coefficient (Ī±T) of 0.1%.
– **Packaging and Compliance:** Plastic package rated V-0 for flammability, matte tin lead-free plated, halogen-free, and compliant with RoHS standards.
– **Pb-free E3:** Indicates second-level interconnect is Pb-free, with tin (Sn) used for terminal finish per IPC/JEDEC J-STD-609A.01.
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