FEATURES:
– **Peak Pulse Capability**: 1500W at 10/1000Ī¼s waveform, with a repetition rate (duty cycle) of 0.01%.
– **Package**: DO-201 package with a glass passivated chip junction.
– **Response Time**: Typically less than 1.0ps from 0 Volts to BV min (Breakdown Voltage minimum).
– **Clamping Capability**: Excellent at limiting transient voltage spikes.
– **Failure Mode**: Typically shorts out when exposed to over-specified voltage or current.
– **Whisker Test**: Conforms to JEDEC JESD201A standards (table 4a and 4c).
– **ESD Protection**: Meets IEC 61000-4-2 standards with 30kV for both air and contact discharge.
– **EFT Protection**: Complies with IEC 61000-4-4 for protecting data lines.
– **Incremental Surge Resistance**: Low, with typical leakage current (IR) less than 1Ī¼A when VBR min > 12V.
– **High Temperature Soldering**: Can withstand reflow soldering up to 260Ā°C for 30 seconds with a 9.5mm lead length and 2.3kg tension.
– **Temperature Coefficient**: VBR varies with temperature (TJ) based on the formula VBR@TJ = VBR@25Ā°C x (1 + Ī±T x (TJ – 25)), with Ī±T typically 0.1%.
– **Flammability Rating**: Plastic package rated V-0 per Underwriters Laboratories.
– **Lead Finish**: Matte tin lead-free plated.
– **Environmental Standards**: Halogen-free and RoHS compliant.
– **Pb-free E3**: Second-level interconnect is lead-free, with terminal finish material tin (Sn), conforming to IPC/JEDEC J-STD-609A.
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