features:
1. **600W Peak Pulse Capability at 10/1000Ī¼s**: This diode can handle transient spikes up to 600W of power with a waveform characterized by a 10/1000Ī¼s pulse width, at a very low repetition rate (duty cycle) of 0.01%. This capability makes it suitable for protecting sensitive electronic circuits from sudden voltage surges.
2. **Glass Passivated Chip Junction in DO-15 Package**: The diode is packaged in a DO-15 package, which typically allows for good heat dissipation and mechanical robustness. The glass passivation helps to protect the junction and improve long-term reliability.
3. **Fast Response Time**: The diode exhibits a very fast response time of typically less than 1.0ps from 0 Volts to its minimum breakdown voltage (BV min). This rapid response ensures that it clamps the transient voltage spike quickly, preventing damage to downstream components.
4. **Excellent Clamping Capability**: It has excellent clamping capability, which means it can limit the peak voltage during a transient event to a safe level, protecting the circuitry.
5. **Typical Failure Mode**: When exposed to voltages or currents beyond its rated specifications, the diode typically fails in a short circuit mode. This failure mode is advantageous as it does not allow damaging voltages to propagate further.
6. **Whisker Test (JEDEC JESD201A)**: This test ensures that the diode meets specific industry standards for whisker formation, which can affect long-term reliability and performance.
7. **ESD (Electrostatic Discharge) and EFT (Electrical Fast Transients) Protection**: It complies with IEC 61000-4-2 for ESD protection up to 30kV (Air and Contact discharge) and IEC 61000-4-4 for EFT protection. These standards ensure that the diode can withstand and protect against common electromagnetic disturbances.
8. **Low Incremental Surge Resistance**: The diode offers low incremental surge resistance, minimizing the impact on circuit performance during surge events.
9. **Low Leakage Current (IR)**: The leakage current (IR) is typically less than 1Ī¼A when the minimum breakdown voltage (VBR min) exceeds 12V. This low leakage current is essential for maintaining efficiency and reliability in the circuit.
10. **Compatible with High Temperature Reflow Soldering**: It can withstand high-temperature reflow soldering processes (up to 260Ā°C for 30 seconds), which is standard in modern electronics manufacturing.
11. **Temperature Characteristics**: The breakdown voltage (VBR) varies with temperature (TJ), following a temperature coefficient (Ī±T) of approximately 0.1%. This characteristic ensures consistent performance across a range of operating temperatures.
12. **UL Recognized Epoxy**: The epoxy used is UL Recognized with a V-0 flammability classification, indicating high flame resistance.
13. **Matte Tin Lead-Free Plating**: The diode features matte tin lead-free plating, complying with RoHS (Restriction of Hazardous Substances) regulations and environmental standards.
14. **Halogen-Free and RoHS Compliant**: It is manufactured using materials that are halogen-free and compliant with RoHS directives, ensuring minimal environmental impact.
15. **Pb-Free E3**: This designation confirms that the diode’s second-level interconnects are lead-free, and the terminal finish material is tin (Sn), meeting IPC/JEDEC J-STD-609A.01 standards.
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