Glass passivated chip junction available in unidirectional and bidirectional variants. It boasts 600 W peak pulse power capability with a 10/1000 Ī¼s waveform, featuring a repetitive rate (duty cycle) of 0.01%. This device offers excellent clamping capability, very fast response time, and low incremental surge resistance. It is solder-dip capable up to 275 Ā°C for a maximum of 10 seconds per JESD 22-B106 standard and is AEC-Q101 qualified.
Description
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Features
ā¢ 1500W peak pulse power capability at 10/1000s waveform, repetition rate (duty cycles):0.01%
ā¢ Excellent clamping capability
ā¢ Low incremental surge resistance
ā¢ Typical IR less than 1A when VBR min>12V
ā¢ Excellent clamping capability
ā¢ Low incremental surge resistance
ā¢ Typical IR less than 1A when VBR min>12V
ā¢ For surface mounted applications to optimise board space
ā¢ Low profile package
ā¢ Built-in strain relief
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ā¢ Whisker test is performed in accordance with JEDEC JESD201A table 4a and 4c
ā¢ IEC 61000-4-2 ESD 30kV (Air), 30kV (Contact)
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If: 200 mA Forward Current
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Cut tape for packaging
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Case:DO-214AA (SMB)
Molding compound meets UL 94 V-0 flammability rating
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Terminals:
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E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix meets JESD 201 class 2 whisker test
Polarity:
For uni-directional types the band denotes
cathode end, no marking on bi-directional types
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