features:
1. **Peak Pulse Capability**: Can handle peak pulse power up to 600W with a 10/1000Ī¼s waveform, and operates with a duty cycle of 0.01%. This indicates its ability to protect against high-energy transient voltage spikes.
2. **Package**: Housed in a DO-15 package, which is a cylindrical axial package commonly used for diodes. This package type is robust and allows for efficient heat dissipation.
3. **Construction**: Features a glass passivated chip junction. Glass passivation helps to protect the internal semiconductor junction from environmental factors, ensuring long-term reliability.
4. **Response Time**: Offers a very fast response time, typically less than 1.0ps from 0 Volts to its minimum breakdown voltage (BV min). This rapid response time is crucial for effectively clamping transient spikes and protecting sensitive electronic components.
5. **Clamping Capability**: Demonstrates excellent clamping capability, meaning it can limit the peak voltage during transient events to a safe level, protecting downstream circuitry.
6. **Failure Mode**: Typically fails in a short circuit mode when exposed to voltages or currents beyond its specifications. This failure mode helps prevent further damage to the circuit.
7. **Whisker Test**: Has undergone a whisker test based on JEDEC JESD201A standards. This test ensures that the diode’s construction and materials are free from metal whiskers, which could cause electrical shorts or other issues over time.
8. **ESD and EFT Protection**: Complies with IEC 61000-4-2 standards for Electrostatic Discharge (ESD) protection (30kV Air and Contact discharge) and IEC 61000-4-4 for Electrical Fast Transients (EFT) protection. These standards ensure robust protection against electromagnetic disturbances.
9. **Incremental Surge Resistance**: Features low incremental surge resistance, which helps maintain efficient operation and minimizes voltage drops during surge events.
10. **Leakage Current (IR)**: Exhibits a typical leakage current of less than 1Ī¼A when the minimum breakdown voltage (VBR min) exceeds 12V. This low leakage current contributes to energy efficiency and reliability.
11. **Soldering Compatibility**: Designed to be compatible with high-temperature reflow soldering processes (260Ā°C for 30 seconds), which facilitates ease of manufacturing and assembly in modern electronics production.
12. **Temperature Characteristics**: Breakdown voltage (VBR) varies with temperature (TJ) according to a specified temperature coefficient (Ī±T), typically around 0.1%. This characteristic ensures consistent performance across different operating temperatures.
13. **Epoxy and Plating**: Uses UL Recognized epoxy with a V-0 flammability classification and matte tin lead-free plating. These features meet RoHS compliance standards, ensuring environmental friendliness and safety.
14. **Halogen-Free and Pb-Free**: Manufactured using halogen-free materials and Pb-free (E3) second-level interconnects, with the terminal finish material being tin (Sn). This compliance with IPC/JEDEC J-STD-609A.01 standards underscores its environmental responsibility.
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