features:
ā¢ Glass passivated pellet chip junction
ā¢ Ultrafast reverse recovery time
ā¢ Low forward voltage drop
ā¢ Low switching losses, high efficiency
ā¢ High forward surge capability
ā¢ Solder dip 275 Ā°C max. 10 s, per JESD 22-B106
features:
ā¢ Glass passivated pellet chip junction
ā¢ Ultrafast reverse recovery time
ā¢ Low forward voltage drop
ā¢ Low switching losses, high efficiency
ā¢ High forward surge capability
ā¢ Solder dip 275 Ā°C max. 10 s, per JESD 22-B106
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