P6KE91A (pack of 10)

FEATURES:

1. **Peak Pulse Capability**: Capable of handling peak pulse power up to 600W with a 10/1000μs waveform, at a low duty cycle of 0.01%. This indicates its ability to protect against short-duration, high-energy transient voltage spikes.

2. **Package**: Housed in a DO-15 package, which is a cylindrical axial package commonly used for diodes. This package type allows for efficient heat dissipation and mechanical robustness.

3. **Construction**: Utilizes a glass passivated chip junction. Glass passivation helps to protect the semiconductor junction from external environmental factors, ensuring long-term reliability.

4. **Response Time**: Fast response time of typically less than 1.0ps from 0 Volts to its minimum breakdown voltage (BV min). This rapid response ensures effective clamping of transient spikes, preventing damage to sensitive components.

5. **Clamping Capability**: Demonstrates excellent clamping capability, which is essential for limiting the peak voltage during transient events to a safe level.

6. **Failure Mode**: Typically fails in a short circuit mode when exposed to voltages or currents beyond its specifications. This mode of failure protects downstream components from excessive voltage or current.

7. **Whisker Test**: Has undergone a whisker test based on JEDEC JESD201A standards. This test assesses the propensity for metal whisker growth, ensuring reliability over extended periods of use.

8. **ESD and EFT Protection**: Complies with IEC 61000-4-2 standards for Electrostatic Discharge (ESD) protection (30kV Air and Contact discharge) and IEC 61000-4-4 for Electrical Fast Transients (EFT) protection. These standards ensure robust protection against electromagnetic disturbances.

9. **Incremental Surge Resistance**: Features low incremental surge resistance, minimizing voltage drops and maintaining circuit efficiency during surge events.

10. **Leakage Current (IR)**: Exhibits a typical leakage current of less than 1μA when the minimum breakdown voltage (VBR min) exceeds 12V. This low leakage current enhances energy efficiency and reliability.

11. **Soldering Compatibility**: Compatible with high-temperature reflow soldering processes (260°C for 30 seconds), facilitating ease of manufacturing and assembly in modern electronics production lines.

12. **Temperature Characteristics**: Breakdown voltage (VBR) varies with temperature (TJ) according to a specified temperature coefficient (αT), typically around 0.1%. This characteristic ensures consistent performance across different operating temperatures.

13. **Epoxy and Plating**: Uses UL Recognized epoxy with a V-0 flammability classification and matte tin lead-free plating. These features meet RoHS compliance standards, indicating environmental friendliness and safety in manufacturing and disposal.

14. **Halogen-Free and Pb-Free**: Manufactured using halogen-free materials and Pb-free (E3) second-level interconnects, with the terminal finish material being tin (Sn). This compliance with IPC/JEDEC J-STD-609A.01 standards further underscores its environmental responsibility.